Laser systems or machines for surface treatment or perforation at wide material webs or sheets
Laser systems/machines for surface treatment or perforation at wide material webs or sheets as packing, bag, sack, craft, tipping, cigarette, filter paper, fabrics, textiles, metal material and others in using of a high power CO2 dual laser beam multiplexers patent grant DE102004001327.
Laser perforation in general
Possible to perforate by pulsed or enlarged and focused laser beams are holes sizes from 60 to 200 m at density of holes of typical 10 to 30 holes per cm, holes sequences from 100.000 to 500.000 holes per second at a maximal of 16 punctured rows by laser distributed over the width of the web with traditional systems/machine. Their porosity levels are from 100 to 3000 C. U., normally with web widths up to 500 mm and web speeds of up to 600 m/min, depending on porosity and material consistency to perforate them.
IPM's wide web laser perforation technology LPM-1
IPM owns development of LASER PERFORATION technology LPM-1 is patent grant by DE 102004001327 and operates with quadruple beam inputs up to 8 KW to a high power CO2 laser beam multiplexer to generate up to 200 individual laser perforation rows across the web, combines automatic positioned laser perforation heads, focus setting, web speeds up to 400 m/min, web widths up to 2000 mm, up to 2,000.000 holes per second, jumbo-roll-by-roll production, optical online permeability/perforation line positioning control, porosity feedback, high automation grad and other features. Each laser perforation lines are archive able from 100 up to 1000 C.U.
Base conception of dual laser beam multiplexer and other industry applications
The conception of high power laser beam multiplexers enable many possibilities in other industry application fields as cutting, cut-offs, welding, surface finishing, drilling, polishing, forming, surface treatment, roughness improvement, etc.
Each of the 200 single perforation head can be positioned across the running web or static positioned material. The automatic processes, equipments and devises opening completely new possibilities in industry, science, military, defense or space laser application. Patent grant for process and device DE102004001327.
Highly automated motor/robotic adjustable/driven focusing optics for/one each perforation head allow a PLC controlled and precise positioning across the web/sheet material. The procedure looks like as full automatic controlled knife setting system on a slitting machine. That state-of-the-art automatic procedure and their devices open now fully new industry challenges in wide web laser perforation and many other application fields.
Hollow wave guides
In using of new CO2 hollow wave guide fibres, one rotary cubic element, or two quadruple beam splitters, or high speed polygon facet wheel into the centre of the optical high power twin multiplexer generating as industrial suited up to 200 optical single channel outputs. Between the laser perforation section and rewind stand is the optical online porosity scanning system OPSS-1 located which controlled very precise each laser line position, the holes qualities, holes quantities as well all porosity levels of the fast running material web.
LPM-1 paper perforation
A new high power Laser multiplexer for wave lengths from 500 nm up to 10.6 m allows by four main beam inputs up to 200 single beam outputs, up to 6 laser rows on one each bobbin, automatic laser line positioning and setting, by two 4/8 KW Laser beam sources, web speeds up to 400 m/min, web widths up to 2000 mm, jumbo roll-by-roll and fully automatic production, up to 20 bobbins in one cut which means up to 160 bobbins without any machine stops including the optical OPSS-1 porosity scanning and feed-back control system.
MLL-1 Micro Laser Line Perforation for holes pattern, perforation design, e.g. waves, zigzag lines, line packages, cryptograms, company logos, holograms, anti counterfeiting product indicators. Patent pending for process, device and product property DE102004012081.
MLL-1 Micro Laser Line Perforation for holes pattern, perforation design, e.g. waves, zigzag lines, line packages, cryptograms, company logos, holograms, anti counterfeiting, product indicators. Patent pending for process, device and product properties. DE102004012081.
LPM-1 micro laser perforation at wide web material with high power CO2 dual laser beam multiplexers and splitters, patent grant for process and device DE102004001327.
ESP electrostatic nano micro perforation machines for cigarette, tipping, filter, packaging, plug-wrap and other paper products, patent grant for process and device DE10328937 of IGBT power switching unit.
Optical online OPSS-1 porovision control/scanning system for ESP or LASER perforation machines,
patent pending for process and device DE10251610 - China patent grant 200310104764.
Title: Micro-laser line perforation for web materials such as paper, metal or other substrates and laser application fields in industry (paper, packaging or cigarette industry) and research (Ref: 06 DE NRXE 0FGK )
Micro-laser line perforation for web materials such as paper, metal or other substrates and laser application fields in industry (paper, packaging or cigarette industry) and research
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